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Modular Optical 3D Measurement

ZEISS ARAMIS Adjustable

Deformation analysis and material testing.

Engineer at a monitor showing ARAMIS strain measurement of a tensile specimen, the sensor aimed at the test rig

Overview

ZEISS ARAMIS Adjustable is a modular optical 3D measurement system designed for precise 2D and 3D analysis of statically and dynamically loaded components and materials. Built on Digital Image Correlation (DIC) and point tracking technology, the system measures full-field displacement, strain, deformation, and motion without physical contact.

Its individually configurable architecture allows camera configurations, measuring volumes, and lighting solutions to be tailored to specific testing requirements. Integrated with ZEISS CORRELATE software, ARAMIS Adjustable enables engineers to validate simulations, optimise product designs, and gain deeper insight into component behaviour.

digital image correlation strain analysis material testing deformation measurement

Key capabilities

  • Digital Image Correlation (DIC)
  • Full-field strain & displacement
  • Configurable camera setup
  • ZEISS CORRELATE software
See it in action

Watch the ZEISS ARAMIS Adjustable in action

A short walkthrough of the system, its measurement workflow, and typical applications.